DIP COATING

TECHNOLOGY 

Dip Coating is a widely used deposition technique that can be divided into five steps: 

Immersion: The substrate is immersed into a dissolved material

Withdrawal: The substrate which has been dipped for a determinate period of time, starts to withdrawn.

Deposition: The film is deposited on the substrate while it is pulled up. The withdrawal speed determines the thickness of the deposited film.

Drainage: The excess of liquid is drained from the surface.

Evaporation: The solvent is evaporated from the deposited liquid film, resulting in the final coating. Volatile compounds start evaporating.

You can control the coating thickness by managing different parameters. After the deposition, a drying time is necessary. Other post and pre-treatments can be requested.

Speed Range

0,02 mm/min to
500 mm/min

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ND DC 150
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Software interface

Complete control of the different available options

Control of the initial and final positions

Immersion speed

Inmersion time

Withdrawal speed

Stirrer speed

Process sequencing

Number of cycles

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Save your formulas for further uses

Its broad range of applications includes the fabrication of solar cells, electronic components, sensors, protective layers or biocide layers and other smart coatings, sol-gel processing or self-assembled monolayers.

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    THEY ALREADY TRUST US

    A lot of parameters can be adjusted, large range of speed.
    University of Pisa, Italy
    Very intuitive and easy to manipulate
    Public University of Navarra, Spain
    Versatile, simple to use
    Institute of Polymer Materials and Technology, Kazakhistan
    Simplicity of using and not so much space dedicated to in the lab CNRS
    Centre National de la Recherche Scientifique, France
    Simplicity of design
    Nanyang Technological University, Singapore
    Efficient, easy to use
    CETIM, Spain
    Practical
    Freie Universität Berlin, Germany