DIP COATING
TECHNOLOGY
Dip Coating is a widely used deposition technique that can be divided into five steps:
Immersion: The substrate is immersed into a dissolved material
Withdrawal: The substrate which has been dipped for a determinate period of time, starts to withdrawn.
Deposition: The film is deposited on the substrate while it is pulled up. The withdrawal speed determines the thickness of the deposited film.
Drainage: The excess of liquid is drained from the surface.
Evaporation: The solvent is evaporated from the deposited liquid film, resulting in the final coating. Volatile compounds start evaporating.
You can control the coating thickness by managing different parameters. After the deposition, a drying time is necessary. Other post and pre-treatments can be requested.

Speed Range
0,02 mm/min to
500 mm/min
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different size?

ND DC 150
ND DC 300
ND DC 600*
*Customized. Please consult.
Your size…
Software interface
Complete control of the different available options
Control of the initial and final positions
Immersion speed
Inmersion time
Withdrawal speed
Stirrer speed
Process sequencing
Number of cycles
Save your formulas for further uses
Its broad range of applications includes the fabrication of solar cells, electronic components, sensors, protective layers or biocide layers and other smart coatings, sol-gel processing or self-assembled monolayers.

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